Sales of Rapid Reflow Oven starts

NXP Semiconductor ordered the first Rapid Reflow Oven developed and produced by 2M Engineering ltd. The Rapid Reflow Oven is designed for ultra short temperature transition times and high temperature stability, over its full range from 25-500°C. This makes the Rapid Reflow Oven the ideal platform for high temperature solder applications like gold tin, gold germanium and gold silicon, curing of temperature based glues and many other applications.
More information on the Rapid Reflow Oven..

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