Printed Electronics RFID multi sensor

Comparison state-of-the-art PCB creation & Printed Electronics

2M Engineering and Domicro, specialist in Printed Electronics technology, work together in investigating the comparing printed electronics to state-of-the art, but conventional PCB technologies. The comparison includes both PCB making, component placement and assembly.

RFID Temperature & Activity logger

For this purpose we defined a multi-sensor RFID demonstrator that we build two times. One time using printed electronics technologies and also using conventional printed circuit technology and component assembly.

Possible application

The technology demonstrator measures and logs temperature and mechanical shocks. This is potentially relevant to track assets during transportation. Measurements can be read using a RFID enabled smartphone. A simple display can indicate when the package was exposed to certain (too) high temperatures or shocks.

Key features

Extremely thin & flexible
Small size – credit card size battery powered unit
Components
- 3D accceleration sensor
- Temperature sensor,
- Data logger,
- Connectivity: RFID data readout via smartphone
- Display
- Battery powered
Tracking of valuable assets

State of the art PCB technologies

The technology demonstrator contains a rechargeable battery of 0.2mm thick that powers the microcontroller. An innovative two state printed polymer screen of 0.5mm displays if the package was misused. The PCB of 0.35mm thick contains the microcontroller with integrated temperature sensor, RFID antenna and accelerometer. The component height is 0.5mm. This results in an actively powered sensor including screen of 1,2mm thick. Overall size is creditcard size, mostly due to the size of the RFID antenna. Firmware has been created to demonstrate the functionality.

Printed Electronics

At the moment the same electronics schematic is made using printed electronics techniques. Creating stable resistors and capacitors with varying temperature and humidity is still a challenge in printed electronics techniques therefore conventional passive components will be used. Date: 07-03-2018

Hereby also the PE version. The foil is slightly thinner and flexible (also possible to achieve with flexfoil) and components are mechanically fixated to prevent the electric contacts to break when the foil is folded. Date: 28-08-2018

Partners

DoMicro, 2M Engineering